PoE PCIe Board
2-port 10GbE network adapter with IEEE 802.3at PoE+ machine vision frame grabber card
Size: 167.7 x 111.2(mm)
PoE PCIe Board
Low-profile 4-port Server-grade Gigabit PoE+ Card with 2 kV Surge Protection
Size: 167.7 x 111.2(mm)
PoE PCIe Board
4-Port / 2-Port Server-grade Gigabit 802.3at PoE+ Frame Grabber Card
Size: 167.7 x 111.2(mm)
USB 3.0 PCIe Board
8-Port/4-Port USB 3.0 Host Adapter Card with 4x Independent USB 3.0 Controllers
Size: 167.7 x 111.2 (mm)
Compact Module with ARM Cortex-A9 Freescale i.MX6 single/dual core on board
Storage : Micro SD cardslot
Size: 40 x 36 (mm)
Compact Module with ARM Cortex-A9 Freescale i.MX6 single/dual core on board
Storage : Onboard eMMC (default 4GB)
Size: 40 x 36 (mm)
Compact Module with ARM Cortex-A9 Freescale i.MX6 single/dual core on board
Storage : Onboard eMMC (default 4GB)
Size: 40 x 36 (mm)
Compact Module with ARM Cortex-A9 Freescale i.MX6 single/dual core on board
Storage : Onboard eMMC (default 4GB)
Size: 40 x 36 (mm)
Compact Module with ARM Cortex-A7 Freescale i.MX6 single core on board
Storage : QSPI (default 256MB)
Size: 40 x 36 (mm)
Carrier Board support for Intel Edison, TechNexion Pico CoM modules
Sensors : Altimeter, 3D Accelerometer, Gyroscope, RTC
Size: 95 x 95 (mm)
ARM Cortex-A9 Freescale i.MX6 scalable single/dual/quad core EDM type 1 compact System-on-Module
Size: 82 x 60 (mm)
ARM Cortex-A9 Single core + ARM Cortex M4 Freescale i.MX6 SoloX EDM Type 1 compact System-on-Module.
Size: 82 x 60 (mm)
ARM Cortex-A9 Freescale i.MX6 scalable single/dual/quad core EDM type 2 compact System-on-Module
Size: 82 x 60 (mm)
Carrier Board support for EDM1
Intergrated HDMI, TTL, LVDS display interface
Size: 147 x 102 (mm)
Carrier Board support for EDM1
Integrated HDMI, TTL, LVDS display interface
Size: 147 x 102 (mm)
Carrier Board support for EDM2
Integrated HDMIx2,LVDSx2 display interface
Size: 244 x 244 (mm)
Carrier Board support for EDM2
Integrated HDMIx2,LVDSx2 display interface
Size: 147 x 102 (mm)
TI Sitara AM3517 application processor with ARM Cortex-A8 CPU and POWERVR SGX 530 for 2D and 3D graphics acceleration.
Size: 67.6 x 50 x 3.4 (mm)
TI OMAP 3530 application processor with ARM Cortex-A8 CPU, integrated DSP and POWERVR SGX 530 for 2D and 3D graphics acceleration.
Size: 63.5 x 35 x 6.4 (mm)
3.5" Sub Compact Board
IntelR CeleronR N2930/N2807 Processor on board
Size: 146 x 101.6 (mm)